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Photoresist is the material with the highest technical barrier among electronic chemicals, which has the characteristics of high purity requirements, complex production process, large investment in production and testing equipment, and long technology accumulation period. From the perspective of related technologies, the core technology of photoresist includes formula technology, quality control technology and raw material technology. Formula technology is the core of photoresist to realize its function, and quality control technology can ensure the stability of photoresist performance, while the quality of photoresist material plays a key role in the quality of photoresist.

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Photoresist consists of film forming resin (polymerizer), photoinitiator, solvent and additive. Film forming resin is used to polymerize different materials in photoresist, forming the skeleton of photoresist, determining the hardness, flexibility, adhesion and other basic properties of photoresist. Photoinitiator, including photosensitizer and photoacid producing agent, is the key component of photoresist, and plays a decisive role in photoresist sensitivity and resolution.

The solvent is the largest component of the photoresist. The purpose is to keep the photoresist in liquid state, but the solvent itself has little effect on the chemical properties of the photoresist. Additives include monomers and other auxiliaries, monomers can regulate the photochemical reaction of photoinitiator, and auxiliaries are mainly used to change the specific chemical properties of photoresist.

Data show that resin accounts for 50% of the total cost of photoresist, the largest proportion in photoresist raw materials, followed by 35% monomer and 15% photoinitiator and other auxiliaries. For high-end photoresist, resin accounts for a higher proportion of the cost.


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